Hire for the Fellow Engineering

Job Description

What you do at AMD changes everythingAt AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies building blocks for gaming, immersive platforms, and the data center.Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the extra mile to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world. If you have this type of passion, we invite you to take a look at the opportunities available to come join our team. Packaging Engineering Fellow What you do at AMD changes everythingAt AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies building blocks for gaming, immersive platforms, and the data center.Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the extra mile to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world. If you have this type of passion, we invite you to take a look at the opportunities available to come join our team. The Role As a member of AMDs Advanced Packaging team, you will drive new 3D advanced packaging technology development and establish proof of concept that is HVM scalable with the ecosystem partners to support new AMD products. You will also be active in researching new tools, materials working with Universities and consortia to drive the next big thing in 3D interconnects. The Person
• The candidate should have a proven track record and extensive knowledge and experience in Wafer Level Process Integration, BEOL Integration, 2.5D/3D integration with TSV, Hybrid Bonding etc.
• He/she should have a hands-on approach to new process development as well as excellent oral and written communication skills to communicate ideas with Technology Partners, Colleagues, Product Architects and AMD Management.
Key Responsibilities
• Develop and prototype cutting edge advanced 3D packaging technologies for AMD products.
• Partner with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions which meet product requirements.
• Enable development partners in the AMD supply chain to develop and demonstrate these concepts in low volume.
• Partner with Product teams and Manufacturing Engineering to demonstrate reliability and smoothly transition new packaging technologies from concept through NPI.
Preferred Experience
• Fundamental knowledge and hands on experience in BEOL technologies, TSV integration, 2.5D/3D integration, Hybrid bonding technologies.
• Good knowledge in design and reliability, such as TV design, CPI, Thermo-mechanical analysis, DFR/DFM etc.
• Familiarity with Advanced Packaging Techniques, including fan-out, 3D stacking, 2.5D and MCM packaging techniques for improved functionality at the lowest cost.
Extensive experience driving innovative advanced silicon and/or packaging Academic Credentials
• BS/MS/PhD in Computer Science, Applied Mathematics, Electrical Engineering, Mechanical Engineering. Materials science and engineering or equivalent.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information. #LI-AP2 Requisition Number: 170942 Country/Region/Location: India State/Province: Karnataka City: Bangalore Job Function: Other EngineeringApply nowApply nowApply for JobEnter your email to apply,

Keyskills :
3d packagingsupply chaincontinuous improvement facilitationchanging the world