RFIC Packaging Designer

Job Description

Our Team:You will be joining a team of highly accomplished engineers and architects with a diverse background from across the computing industry. As a member of this group you will work on developing solutions that require innovations from systems to materials. As the computing requirements across IoT, Big Data and AI are increasing, we need optimizations and innovations across all the layers of design. Optimizations at the algorithm, software and silicon design level is not sufficient any more. In order to drive improvements in PPACt (power, performance, area, cost and time-to-market) for the future cloud and edge workloads, we have to develop innovative architectures that will require us to take a new approach to system design. We are looking for engineers who are technically fearless and can drive solutions, where none exist today.Your Opportunity:The Applied Materials AI System Solution Group team is actively recruiting for a highly motivated, energetic, and accomplished RFIC SiP packaging engineer to lead and drive what if analysis for EM, cross talk design and analysis with tradeoff to performance, size, cost, power, thermal, reliability and security aspects of the package.This role also requires interpersonal skills like effective communication, dealing with ambiguities and collaboration with cross-functional teams across system architects, software, firmware and other hardware engineers. Candidate will have the opportunity to contribute for the best standards, methodologies, and practices in system development and grow in this high pace environment.Role and Responsibility

• Serve as the RF System technical lead throughout the full development lifecycle, from scoping, planning, conception, design, implementation, testing, documentation, delivery, and maintenance phases.
• Gather system-level requirements for emerging applications; translate requirements into technical specifications and design that are competitive, scalable, and supportable.
• Research new ideas and concepts for clearly differentiated value for the customers.
• Develop next-gen RF SIP modules on multi-layer organic and glass substrates,
• Define, create, execute and analyze SI experiments and results for influencing engineering decisions in favor of best SI performance while considering other engineering tradeoffs.
• Model High speed host to client system Interfaces like PCIeGen3, DDR4/5, USB3.0 and HDMI to design for optimal SI parameters rise/fall times, dispersion, ISI, eye diagrams, mask compliance, TDR, crosstalk, VSWR, insertion loss and EMI/EMC.
• Simulate mixed-signal wireless module on different types of substrate with TSV.
• Partner closely with cross-functional team members for prototyping, bring-up, measurement, debugging and optimization efforts.
• Mentor others for the best practices and methodologies in system development.

Our Ideal Candidate

• BS/MS/PhD in Electrical or Computer engineering
• 5 years of experience with strong fundamentals in RFIC packaging with emphasis on RF, EM, SI and thermal design, simulation and analysis.
• Proficient in RF PCB design for substrate layout, fabrication, assembly, validation and reliability and help with what if analysis and reviewing design (Schematics and layout/Gerber) files.
• Proficient in Cadence Allegro, Virtuoso, Sigrity/Ansys SiWave/ADS, and HFSS/CST.
• Proficient in using lab equipment like DMM, digital oscilloscopes, NVNA, differential probes, passive/active probes, voltage and current probes, logic analyzers, BERTs and RF impedance measurement probe stations.
• Strong communications skills, ability to clearly document and articulate technical solutions.

QualificationsEducation:Bachelors Degree SkillsCertifications:Languages:Years of Experience:7 - 10 Years Work Experience:Additional InformationTravel:Yes, 10% of the Time Relocation Eligible:YesApplied Materials is committed to diversity in its workforce including Equal Employment Opportunity for Minorities, Females, Protected Veterans and Individuals with Disabilities.,

Keyskills :
big datapcb designcadence allegroleadership skillssystem developmentsystem integratorsinterpersonal skillscontrolled impedanceeffective communication