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Principal Engineer, Mechanical & Thermal Design

7.00 to 12.00 Years   Pune   07 Nov, 2022
Marvell India Pvt Ltd
Job LocationPune
EducationNot Mentioned
SalaryNot Disclosed
IndustryConsumer Durables / Electronics
Functional AreaGeneral / Other Software
EmploymentTypeFull-time

Job Description

    Generate Mechanical Concept designs / architecture design & enclosures based on customer and internal product requirements to deliver a cost-effective solution for Storage Business UnitAssess Mechanical requirements based on customer and system level requirement, identify the Mechanical BOM, including any Heat-sink part requirementsCreate proto designs, work with purchasing/supplier for proto part development and procurementConduct Mechanical verification test to qualify the product (inhouse/outsource)Conduct Local/Global Peer Reviews/Design reviews/Quality reviewsCreate manufacturing drawings, defining tolerances with GD&T and manufacturing instructions for parts and assembliesPerform thermal simulations to determine thermal resistances, power dissipation as well as mechanical stress over temperatureOwn and lead cross-functional technical meetings to vet design trade-offs and proposed solution. Advocate, conduct and participate in Technical ReviewsWill work closely with Hardware & PCB Layout design engineersKeep track of design progress & maintain all the necessary documentationRequirements:BE/BTech or ME/MTech in Mechanical/Thermal or relevant specializationBE/BTech with 10-15 years of experience, Or ME/MTech with 5-10 years of experience designing Mechanical enclosures & performing Thermal simulations & analysisRequires an advanced working knowledge in mechanical-thermal domain to perform first order calculations, tolerance analysis, material assessment, lab measurements & heat transferExperience in CPU or SoC thermal management and hardware/PCB Layout system level mechanical/thermal designGood understanding of mechanical & thermal aspects for server designs, OCP server chassis modelingExpertise and experience in finite elements modeling and finite volume modeling, CAD system.Familiarity with analysis of Finite element stress & strains in IC packaging is a plusWorking knowledge of different Thermal Interface Materials (TIM) and exposure to industry standards & supporting manufacturersExperience with PCIe add-on cards, enclosures, fixtures, motherboards will be a plusMust have effective interpersonal and teamwork skills and excellent verbal and written communication skillsStrong debug, analysis, problem-solving skills with experience leading root cause and corrective action across teamsInherent sense of urgency and accountability. Must have the ability to multi-task in a fast-paced environmentSemiconductor Industry background is an added advantage,

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