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Job Location | Hyderabad |
Education | Not Mentioned |
Salary | Not Disclosed |
Industry | Consumer Durables / Electronics |
Functional Area | Sales / BD |
EmploymentType | Full-time |
Do you like to work on groundbreaking technologies that span mobile, consumer and high- performance applicationsAre you looking to lead and strengthen a team of experts who will get to work on products that impact billions of peopleWe are looking for a hardworking Semiconductor Packaging Master Designer to join our global team.
As the package design manager at Micron Technology, Inc., you will be responsible for the enablement of effective package layouts that meet exceptional technical standards. In this highly visible role, you will own and drive advanced package design and development. You will have ultimate responsibility for package/SIP layout, optimization, layout verification and taping out.
In addition to hands- on design, you will also be responsible to growth and management of several technical direct. You will be also required to scale your group to meet business requirements. You will have end- to- end design ownership on a wide variety of products and package structures, including mobile, advanced DRAM, and ASIC packages.
Qualifications:Leadership
Keyskills :
continuous improvement facilitationflip chipautocad 2ddie designgap analysisdesign supportcadence allegroschematic capturefeasibility studieslayout verificationperformance metricsmanufacturing processmechanical engineeringcontinuous improveme